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      Qualified SMT patch solder joints should have the following characteristics:
       
       
       
      1. Good appearance of solder joint of PCB plate
       
       
       
      (1) The solder joints on the PCB plate with good welding quality should be clean, smooth and metallic luster. If there is dirt on the surface of PCB and welding residue, it may corrode the lead, pad and printed circuit board of components. If moisture is absorbed, it may cause local short circuit or leakage accident.
       
       
       
      (2) There should be no burrs, voids and tin dragging on the surface of solder joints on PCB plate. This will not only affect the beauty of SMT patch solder joints, but also bring unexpected hazards, especially in high-voltage circuit may produce tip discharge, resulting in damage to electronic products.
       
       
       
      (3) There is no abnormal sample on the surface of solder joints on PCB plate, otherwise it may cause false soldering and false soldering of solder joints, leading to unreliability of SMT patch solder joints.
       
       
       
      (4) Overlap welding and bump welding are not allowed to avoid short-circuit events.
       
       
       
      (5) The amount of solder should be appropriate, not too much or too little. Smt patch solder joints have flat surface with half arch concave, smooth transition at the junction of solder joints, small contact angle, so that they can be qualified solder joints.
       
       
       
      2. The solder joints on PCB plate should have reliable electrical connection
       
       
       
      There are two main functions of solder joints in welding: one is to connect two or more components through solder; the other is to require good electrical characteristics. Therefore, it is not feasible for a solder joint to pass a certain current stably and reliably without enough connection area and stable structure. Tin bonding does not depend on pressure, but on the combination of layered and firmly connected alloy layer to achieve the purpose of electrical layer connection. If only the filler metal is overlayed on the surface of the welding components to form virtual welding, or only a small part of the alloy layer, then it may not be easy to find the solder joint is not firm in the test and initial work, but with the change of working conditions of the time, the contact layer oxidation may occur after the de-soldering phenomenon, the circuit will be interrupted or simply do not work. At this time, through the eyes to observe the appearance of the welded circuit board, the circuit is still connected, that is, it is not easy to check out with the eyes, which is the most headache in the use of electronic equipment. Therefore, solder joints must have reliable electrical connections.
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